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Safety
Ergonomics
26 Dimension 3100 Manual Rev. D
2.2.3 Sample Safeguards
2.3 Ergonomics
The Dimension 3100 SPM design promotes compatibility in the integration of user personnel and
equipment within a semiconductor manufacturing environment. Specifically, the ergonomics of the
Dimension 3100 SPM design prevent personal injury, equipment damage, and minimizes
procedural errors.
CAUTION: Do not change samples in the middle of operation. Verify that the
stage is clear of tools, objects, and debris at all times. Use alcohol
wipes periodically to keep the stage clean of dust. Dispose of wipes
in an appropriately labelled solvent-contaminated waste container.
ATTENTION: Ne pas changer d’échantillon en cours d’utilisation. Vérifier que la
platine n’est pas encombrée, par des outils par exemple. Employer
des tampons d’alcool régulièrement pour dépoussiérer la platine.
VORSICHT: Tauschen Sie keine Proben aus, während sich das System im
Betrieb befindet. Der Probentisch sollte von Werkzeug, anderen
Objekten und Überresten ständig freigehalten werden. Benutzen
Sie ein mit Alkohol getränktes Tuch, um den Probentisch
regelmäßig von Staub zu reinigen.
CAUTION: All interlocks are provided to ensure operator and sample safety.
Do not attempt to bypass interlocks.
ATTENTION: Tous les intelocks sont fournis pour assurer toute sécurité à
l’utilisateur. Ne pas essayer de ne pas les employer.
VORSICHT: Alle Sperrvorrichtungen des Systems sind dazu vorgesehen,
Personal und Probe zu schützen. Versuchen Sie nicht,
Sperrvorrichtungen zu umgehen.
- Dimension 3100 Manual 1
- Ta ble of Contents 3
- List of Figures 13
- Chapter 1 System Overview 21
- 1.1 System Overview 22
- 1.2 Control Station Overview 23
- 1.2.2 Computer 24
- Control Station Overview 25
- Dimension 3100 SPM Overview 27
- 1.3.3 Stage System 29
- 1.3.4 Dimension SPM Head 29
- 1.3.5 Cantilever Holder 33
- 1.3.6 Video Zoom Microscope 34
- Sample Size & Handling 35
- 1.5 Facilities Specifications 36
- 1.6 Applications 36
- Chapter 2 Safety 37
- 2.1 Safety Requirements 39
- 2.2 Safety Precautions 40
- Safety Precautions 41
- 2.2.2 Microscope 43
- 2.3 Ergonomics 46
- 2.4 Environmental Conditions 47
- 2.6.1 Pre Power-up Checklist 48
- Connections 49
- Final Installation 50
- Power-up (Installation Only) 51
- 2.8 Software Power-up 52
- 2.8.2 Log On 53
- 2.8.4 Select Realtime 54
- 2.9 Hazard Labels 55
- 2.9.1 Laser Warning Labels 56
- 3.1 Optional Configurations 58
- 3.1.2 VT-102 59
- 3.1.3 IS3K-2 60
- 3.2 Facilities Requirements 61
- External Vacuum 62
- Supply Module 62
- Facilities Requirements 63
- Top View 66
- Side and Front View 66
- Front View 67
- 3.3.5 ELCON Console 68
- 1959-940-A 70
- General Facilities Guidelines 71
- Chapter 4 Installation 73
- 4.1 Shipping and Receiving 74
- Shipping and Receiving 75
- 4.2 Uncrating the System 76
- Chuck Base 78
- Keyboard MouseTrackball 79
- Installation 81
- OK twice 82
- NanoScope® IIIa 83
- NanoScope® 85
- 4.5 System Power-up 88
- Chapter 5 Stage System 89
- 5.1 Mounting of Samples 90
- Mounting of Samples 91
- 5.2 Stage Menu Commands 92
- 5.2.2 Locate Tip 93
- 5.2.3 Focus Surface 94
- 5.2.4 Move To (X,Y) 96
- 5.2.5 Set Reference 97
- Set Reference 98
- X Axis Y AxisOrigin ResetQuit 98
- 5.2.6 Programmed Move 99
- Stage Menu Commands 102
- 5.2.7 Initialize 103
- 5.2.8 SPM Parameters 105
- 6.1.1 Wafer Tool Kit 108
- 6.1.2 Cantilever Preparation 108
- Silicon Cantilever Substrates 109
- Press here to break out strip 113
- Lever Type 116
- Scanning Profile 117
- Preparation 119
- 7.1 System Information 120
- 7.1.3 Laser Requirements 121
- 7.2 Basic AFM Operation 122
- Basic AFM Operation 123
- 7.2.9 Align Laser 126
- 7.2.10 Adjust Photodetector 131
- 7.2.11 Locate Tip 133
- 7.2.12 Load the Sample 134
- 7.2.13 Focus Surface 135
- 7.3 Advanced AFM Operation 137
- Advanced AFM Operation 138
- Chapter 8 Contact AFM 139
- 8.1.1 Select the Microscope 140
- 8.1.4 Align Laser 140
- 8.1.5 Adjust Photodetector 141
- 8.1.6 Locate Tip 141
- 8.1.7 Focus Surface 141
- 8.1.8 Show All Items 142
- 8.1.10 Engage 145
- 8.2.1 Cantilever Selection 145
- Approach 146
- Jump to contact 146
- Adhesion 146
- Pull-off 146
- 8.3.1 Data Type 147
- 8.3.2 Gain Settings 148
- 8.3.3 Scan Size and Scan Rate 149
- 8.3.4 Setpoint 149
- 8.3.5 Lowpass Filter 149
- 8.3.6 Highpass Filter 149
- 8.4 Force Calibration Mode 150
- Chapter 9 TappingMode AFM 151
- 9.1 Principles of TappingMode 152
- Return signal 153
- (deflected) 153
- Laser beam 153
- Sample surface 153
- 9.2.3 Align Laser 154
- 9.2.4 Adjust Photodetector 154
- 9.2.5 Locate Tip 154
- 9.2.6 Focus Surface 155
- 9.2.7 Cantilever Tune 155
- Frequency Sweep 158
- 9.2.8 Show All Items 159
- 9.2.10 Engage 161
- 9.3 Withdraw the Tip 162
- 9.4.1 Resonating Techniques 163
- 9.4.2 Cantilever Oscillation 163
- 50.00 nm/div 164
- Scan Size - 2.50 µm/div 164
- Drive Frequency 165
- 9.4.5 Data Type 166
- 9.4.6 Gain Settings 166
- 9.4.8 Surface Tune 167
- 9.5 Troubleshooting 168
- Chapter 10 Fluid Imaging 169
- 10.1 Basic Principles 171
- 10.2 Fluid Operation Hardware 171
- 10.2.2 Tip Suggestions 172
- 10.3 Sample Mounting 173
- 10.3.2 Larger Samples 174
- 10.3.3 Smaller Samples 174
- 10.4 Precautions 175
- Precautions 176
- 10.5 Operating Principles 177
- Operating Principles 178
- 10.5.6 Align Laser 179
- 10.5.7 “False” Reflections 180
- 10.5.8 Load Sample 180
- 10.5.9 Lower Probe into Fluid 182
- 10.5.11 Adjust Photodetector 182
- 10.5.12 Locate Tip 183
- 10.5.13 Focus Surface 183
- 10.5.15 Show All Items 189
- 10.5.17 Engage 191
- 10.6 Troubleshooting 193
- Troubleshooting 194
- Microscopy (STM) 195
- 11.1 Introduction 196
- 11.2 Basic STM Operation 197
- Basic STM Operation 198
- parameters 200
- 11.3.1 STM Hardware 201
- 11.3.3 STM Operating Modes 202
- Sensitivity (Å/V) 206
- 11.4.1 Operation of STS 207
- 11.6 Etching Tungsten Tips 212
- Etching Tungsten Tips 213
- 12.1 Introduction 215
- 12.2 Basic LFM Operation 216
- 12.3 Advanced LFM Operation 217
- 12.3.2 Tip selection 218
- High Friction 219
- Low Friction 219
- Advanced LFM Operation 220
- Chapter 13 Force Imaging 223
- 13.1 Force Plots–An Analogy 224
- Force Plots–An Analogy 225
- 13.2 Force Calibration Mode 226
- Force Calibration Mode 227
- 13.2.1 Example Force Plot 229
- Y Offset 233
- 13.3.3 Channel 1, 2, 3 Panels 235
- Total Force 237
- End Mode 238
- 13.3.6 Menu Bar Commands 239
- Piezo travel 240
- Position 240
- 13.4.2 Helpful Suggestions 242
- 13.4.3 Advanced Techniques 243
- 13.5.1 Force Plots 248
- 13.5.3 High Contact Force 252
- 13.5.4 Tip Selection 252
- 13.6 Force Modulation 253
- Force Modulation 254
- 13.6.3 Operating Principle 255
- 13.6.5 Notes About Artifacts 261
- 13.8 Force Volume 265
- Interleave Mode Description 269
- 14.3 LiftMode Description 270
- 14.5.2 Setpoint Selection 272
- Magnetic Force Microscopy 276
- 15.2 Basic MFM Operation 278
- Basic MFM Operation 279
- 15.3 Advanced MFM Operation 284
- 15.3.3 Drive Amplitude 285
- Advanced MFM Operation 286
- 15.4.1 Phase Extender Module 288
- 15.4.2 Quadrex Extender 289
- 15.4.3 NanoScope IV 289
- 15.6 Troubleshooting 290
- Electric Techniques Overview 293
- Electric Force Microscopy 295
- NanoScope 299
- 16.2.4 Phase Detection 311
- 16.2.5 Frequency Modulation 313
- 16.2.6 Amplitude Detection 313
- EFM Troubleshooting/Pointers 315
- 16.3.8 Try Uncoated Si Tip 316
- Chapter 17 Calibration 325
- Section 17.8.6 326
- 17.1 SPM Calibration Overview 327
- SPM Calibration Overview 329
- 17.2 Calibration Setup 332
- Scan Angle = 0° 333
- 17.2.4 Set Up Contact AFM 334
- 17.3.1 Measure Orthogonality 334
- Check Sample Orthogonality 335
- 17.4 Linearity Correction 336
- Linearity Correction 337
- 17.4.2 Adjust Fast mag1 339
- 17.4.3 Adjust Slow mag1 340
- Autocalibration 341
- SKIP to 342
- 17.6 Autocalibration 343
- Draw a horizontal line 347
- 17.8 Calibrating Z 351
- Calibrating Z 352
- 17.8.4 Correct Z Sensitivity 355
- 18.1 Maintenance 358
- Maintenance 359
- 18.1.2 Calibration 360
- 18.1.5 Air Tables 364
- 18.1.6 Air Pressure 364
- 18.1.7 Air Table Feet 364
- 18.1.8 Optics Zoom System 365
- 18.2 Troubleshooting 366
- 18.2.2 Common Problems 368
- 18.3 Warranty 369
- Warranty 370
- 136, 167 374
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