Dell 3100 Spezifikationen PDF herunterladen (Seite 108)

Cantilever Preparation

Silicon Cantilever Substrates

88 Dimension 3100 Manual Rev. D

6.1 Silicon Cantilever Substrates

6.1.1 Wafer Tool Kit

A wafer tool kit for working with silicon cantilever substrates is included with the Dimension 3100

SPM system. The kit contains the following:

•Wafer tweezers

• Flat, substrate tweezers

•Regular tweezers

• Curved, sharp-pointed tweezers

• Flat, L-shaped tweezers

6.1.2 Cantilever Preparation

To prepare the cantilever for imaging:.

1. View the wafer with an optical microscope to determine the orientation of the cantilever

substrates and to inspect the cantilevers themselves.

Note: A 10-70X stereo microscope is useful for this task. The cantilevers are tip-side-

up when viewed in the wafer holder.

2. Disconnect the substrate from the bulk of the wafer by pressing down gently on the non-

cantilever end of the substrate or using sharp-pointed tweezers to carefully break the two

substrate supporting arms connecting the substrate to the silicon wafer frame (see Figure

6.1a).

Note: The supporting arms connecting the substrate to the bulk of the wafer shatter

when pressure is applied. It may be convenient to break several substrates from

the wafer at one time. Extras may be safely stored in a specially prepared petri

dish.

3. At the bottom of the petri dish, place X4-grade, GEL-PAK adhesive strips.

4. Place the substrates, tips facing up, on the adhesive to permit easy removal of the substrates

when needed.

CAUTION: The cantilevers are stored tip-side-up, and the silicon is very

brittle. The cantilever will break off of the substrate if contacted.

1 2 ... 103 104 105 106 107 108 109 110 111 112 113 ... 375 376

Keine Kommentare

Dell 3100 Spezifikationen Seite 108