Dell Inspiron 4100 Bedienungsanleitung Seite 34

  • Herunterladen
  • Zu meinen Handbüchern hinzufügen
  • Drucken
  • Seite
    / 71
  • Inhaltsverzeichnis
  • LESEZEICHEN
  • Bewertet. / 5. Basierend auf Kundenbewertungen
Seitenansicht 33
4. Lift the microprocessor thermal cooling assembly up and out of the system board.
Replacing the Microprocessor Thermal Cooling Assembly
1. Place the right side of the microprocessor thermal cooling assembly under the palm rest and lower the assembly onto the system board.
2. Tighten the four captive screws, labeled 1 through 4, in consecutive order.
Microprocessor Module
Removing the Microprocessor Module
1. Remove the hard drive.
2. Remove the keyboard.
3. Remove the microprocessor thermal cooling assembly.
4. To loosen the ZIF socket, use a small, flat-blade screwdriver and rotate the ZIF-socket cam screw counter-clockwise until it comes to the cam stop.
The ZIF-socket cam screw secures the microprocessor to the system board. Take note of the arrow on the ZIF-socket cam screw.
5. Use a microprocessor extraction tool to remove the microprocessor module.
Replacing the Microprocessor Module
NOTICE: Disconnect the computer and any attached devices from electrical outlets, and remove any installed batteries.
NOTICE: To avoid ESD, ground yourself by using a wrist grounding strap or by touching an unpainted metal surface on the computer.
NOTICE: Read "Preparing to Work Inside the Computer" before performing the following procedure.
NOTICE: Do not touch the processor die. Press and hold the microprocessor down on the substrate on which the die is mounted while turning the cam
screw to prevent intermittent contact between the cam screw and microprocessor.
NOTICE: To avoid damage to the microprocessor, hold the screwdriver so that it is perpendicular to the microprocessor when turning the cam screw.
1
screwdriver (perpendicular to microprocessor)
2
pin-1 corner
3
processor die (do not touch)
4
ZIF socket
5
ZIF-socket cam screw
NOTICE: To ensure maximum cooling for the microprocessor, do not touch the heat transfer areas on the microprocessor thermal cooling assembly. The
oils in your skin reduce the heat transfer capability of the thermal pads.
NOTICE: When removing the microprocessor module, pull the module straight up. Be careful not to bend the pins on the microprocessor module.
NOTICE: Ensure that the cam lock is in the fully open position before seating the microprocessor module. Seating the microprocessor module properly in
the ZIF socket does not require force.
NOTICE: A microprocessor module that is not properly seated can result in an intermittent connection, or permanent damage to the microprocessor and
ZIF socket.
Seitenansicht 33
1 2 ... 29 30 31 32 33 34 35 36 37 38 39 ... 70 71

Kommentare zu diesen Handbüchern

Keine Kommentare